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PCB  Lab Information
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Processes

Thermal Transfer Method



1. Choose 1 plastic and 1 glass container small enough to hold board.



 


2. Fill glass container with Ferric Chloride etch. Fill plastic container with cool tap water. Fill both with 1 inch of liquid.

 

 



NOTE: Wear gloves, apron, and eyewear when handling chemicals.


CAUTION: Ferric Chloride will stain clothing.

3. Remove blank board from package. Clean copper surface with isopropyl alcohol.

 


NOTE: Copper side has shiny metallic surface.

TE: Substrate has dull green or brown surface.

 

4. Print schematic on transfer paper with laser printer.

 


 

5. Cut transfer paper mask to board size with razor if necessary.

 


NOTE: Copper will remain where decals are placed.


6. Place toner side of transfer mask against copper side of board and cover with paper towel.


 


7. Apply heat through paper towel with iron using short even strokes.

 

NOTE: Set iron to highest setting. Process requires 2-3 minutes.


 

8. Remove iron and immediately submerge board in cool water for 15 seconds.

 

NOTE: Paper will be fused to board. Do not peel off.


 

9. Plug sink and soak board in hot water for 10 minutes. Carefully remove paper mask.




 

NOTE: Careful scrubbing with toothbrush may be necessary to remove paper.


10. Submerge board into etch solution copper side up.

 

 



NOTE: Swirling motion will speed up etch process.
CAUTION: Do not spill liquid.


11. Etch process will take up to 30 minutes. Remove board and check progress every 5 minutes. Avoid over etching

 


NOTE: Above etch example not complete. Notice remaining copper


12. Remove from etch. Submerge into cool water copper side up for 2-3 minutes.

 


 

13. Dry board with cloth wipes. Examine trace quality.

 



NOTE: Remaining ink can be removed with isopropyl alcohol.


NOTE: Mistakes can be fixed with conductive ink marker..


For Wet Etch Method click here