Do It Yourself (DIY) Tutorials

Processes

Wet Etch Method

2. Fill glass container with Ferric Chloride etch and another with developer. Fill plastic container with DI water. Fill all with 1 inch of liquid.

NOTE: Wear gloves, apron, and eyewear when handling chemicals.

CAUTION: Ferric Chloride will stain clothing.

3. Plug in UV exposure box and yellow florescent lamp. Turn off white overhead lights.

4. Remove blank photoresist coated board from package. Do not touch surface!!

NOTE: Copper side has shiny metallic surface.

TE: Substrate has dull green or brown surface.

5. Open UV exposure box.

NOTE: Never engage UV lights when lid is open.

6. Place mask transparency face down against glass. Place copper side of board against glass.

7. Close and lock UV exposure box. Set to 5 lamp mode and engage manual switch. Expose 6-8 minutes.

8. Submerge board into developer copper side up. Typical time range is 30 seconds to 2 minutes. Follow times specific to your developer brand.

NOTE: Over-developing can strip off photoresist. Watch profess closely.

9. Submerge board into DI water copper side up for 1-2 minutes

10. Submerge board into etch solution copper side up.

NOTE: Swirling motion will speed up etch process.
CAUTION: Do not spill liquid.

11. Etch process will take up to 30 minutes. Remove board and check progress every 5 minutes. Avoid over etching

NOTE: Above etch example not complete. Notice remaining copper

12. Remove from etch. Submerge into DI water copper side up for 2-3 minutes.

13. Dry board with cloth wipes. Examine trace quality.

NOTE: Remaining ink can be removed with isopropyl alcohol.

NOTE: Mistakes can be fixed with conductive ink marker..

Please clean the lab after you are done with the process.

For Lab Clean up click here